Identify the Main Board assembly. It has part number TD-OCSE-D2-MB printed on its bottom side.
The Main Board should have all surface-mount soldering completed before continuing this process.
For ease of access to the solder pads, it is highly recommended to solder through-hole component H5 before continuing this process.
Do not solder any of the following components yet.
Place components S1 and S4.
Place components S2 and S3.
Place components J1-12.
Note that four pairs of these components each share a common hole for their grounding pins.
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