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Identify the Main Board assembly. It has part number TD-OCSE-D2-MB printed on its bottom side.

The Main Board should have all surface-mount soldering completed before continuing this process.

For ease of access to the solder pads, it is highly recommended to solder through-hole component H5 before continuing this process.

Do not solder any of the following components yet.

Place components S1 and S4.

Place components S2 and S3.

Place components J1-12.

Note that four pairs of these components each share a common hole for their grounding pins.

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